Fu-Kuo Hsueh
In the manufacturing of semiconductor devices, etching corresponds to any technique that removes material systematically from a thin layer on a platform (with or without preceding architecture on its interface) and leaves behind a sequence of that substance on the platform. A cover that is resistive to the etch defines the layout. Once the cover is in position, the exposed material may be etched using either "wet (chemical)" or "dry (physical)" processes.
1. Brief of etch process
2. Etch basic
3. Wet etch process
4. Dry etch_A
5. Dry etch_B
6. Dry etch_C
7. Trend and development
Aout TSRI
The Taiwan Semiconductor Research Institute (TSRI) under the National Applied Research Laboratories (NARLabs) is a consolidation of the National Chip Implementation Center (CIC) and National Nano Device Laboratories (NDL). An integrated research environment for related fields of study in Taiwan is urgently required to enhance the overall cultivation of quality talents in response to the introduction of the 3-nm node; rapid development of new applications (e.g., artificial intelligence, quantum computers, next-gen magnetic random access memory, high-speed computers, and 5G network); and challenges posed by countries including European countries, the United States, Japan, and South Korea.