TE004 Photolithography

Tsai-Ming Huang

Abstract

Photolithography is a patterning process in chip manufacturing. The process involves transferring a pattern from a photomask to a substrate. This is primarily done using steppers and scanners, which are equipped with optical light sources. Other forms of lithography include direct-write e-beam and nanoimprint. There are also several next-generation lithography (NGL) technologies in R&D, such as extreme ultraviolet (EUV), multi-beam e-beam and directed self-assembly (DSA).
As Moore’s law has driven the semiconductor technology roadmap below 1 µm, a steady stream of new technologies has been required to produce leading-edge chips. For most of that roadmap, the enabling engineering solutions were on the processing side. For instance, the development of i-line, then KrF and ArF light sources, advanced resist chemistries, etc.

Outline

Photolithography

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The Taiwan Semiconductor Research Institute (TSRI) under the National Applied Research Laboratories (NARLabs) is a consolidation of the National Chip Implementation Center (CIC) and National Nano Device Laboratories (NDL). An integrated research environment for related fields of study in Taiwan is urgently required to enhance the overall cultivation of quality talents in response to the introduction of the 3-nm node; rapid development of new applications (e.g., artificial intelligence, quantum computers, next-gen magnetic random access memory, high-speed computers, and 5G network); and challenges posed by countries including European countries, the United States, Japan, and South Korea.

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